Global and China Solder Paste Market 2016 Size, Growth And Analysis To 2021

Global Solder Paste Industry is an in-depth report that offers a unique mix of specialist industry knowledge and the region-wise research expertise. The report delivers the market Outlook, Strategy, size, Growth, Share, Forecast, Analysis and the trends for each sector.

This report provides detailed analysis of worldwide markets for Solder Paste from 2011-2016, and provides extensive market forecasts (2016-2021) by region/country and subsectors. It covers the key technological and market trends in the Solder Paste market and further lays out an analysis of the factors influencing the supply/demand for Solder Paste, and the opportunities/challenges faced by industry participants. It also acts as an essential tool to companies active across the value chain and to the new entrants by enabling them to capitalize the opportunities and develop business strategies.

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Solder paste (or solder cream) is used to connect the leads of surface mount integrated chip packages to attachment points (lands) in the circuit patterns on a printed circuit board. The paste is typically applied to the lands using a stencil to “print” the paste (although other methods, like dispensing from a tube, are also used), followed by heating to melt the paste, fusing the connection.

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GCC’s report, Global Solder Paste Industry Report 2016, has been prepared based on the synthesis, analysis, and interpretation of information about the global Solder Paste market collected from specialized sources. The report covers key technological developments in the recent times and profiles leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global Solder Paste market areALENT (USA), INDIUM (USA), Fusion (USA), ITW (USA), Qualitek (USA), AMTECH (USA), Nordson (USA), AIM (Canada), Warton Metals (UK), Henkel (Germany), Heraeus (Germany), Senju (Japan), Tamura (Japan), Koki (Japan), ALMIT (Japan), Heesung Material (Korea), Chungsol (Korea), AH KOREA (Korea), Asahi (Singapore), Shengzhen VITAL (China), Eunow (China), Yongan Technology (China), Shenzhen Kawada (China), Shenzhen Judao (China), Dongguan Jitian (China), Shenzhen Bright (China), Shenzhen Tongfang (China) etc..

The report provides separate comprehensive analytics for the North America, Europe, Asia-Pacific, Middle East and Africa and Rest of World. In this sector, global competitive landscape and supply/demand pattern of Solder Paste industry has been provided.

Table Of Content

Part 1. Scope of Report
1.1 Research Methodology
1.2 Geographic Scope
1.3 Years Considered

Part 2. Introduction
2.1 Key Findings
2.2 Value Chain Analysis
2.2.2 Upstream
2.2.3 Downstream

Part 3. Manufacture
3.1 Manufacturing Process
3.2 Issues and Trends

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