Wire Bonder Equipment Market Forecast By 2025

Wire Bonder Equipment Market is a machine that is used for making interconnects between any
other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-
wire is used to make these connections that are generally made of gold, copper, aluminum or
silver. The global wire bonder equipment market is anticipated to predict a promising growth rate
during the forecast period from 2017 to 2025 owing to the constant introduction of new
electronics like smartphone with improved features that compels the vendors to modify the
manufacturing process with the existing and new standards. Thus it is expected to increase the
demand of wire bond equipment during the forecast period.
The global wire bonder equipment market is expected to witness a highest growth rate in the
coming years due to the emergence of new types of chip packaging. This new type of chip
packaging is likely to offer Integrated Device Manufacturers (IDMs) and Outsourced
Semiconductor Assembly and Testing (OSATs) with new business opportunities in the coming
years. This has led to the increase in growth of the semiconductor packaging equipment like wire
bonder equipment and is expected to witness a promising growth during the forecast period.
With the advent of new packaging technologies like MEMs packaging, TSV packaging has
changed the manufacturing landscape of the semiconductor industry. Thus, the equipment
manufacturers have to undertake significant investment to ensure that their devices are up-to-date
and of latest technologies.
However, the increase complexity of the production process, consumption of additional time and
also the increasing probability of defects is predicted to restrain its growth rate of wire bonder
equipment to some extent during the forecast period. In spite of this challenges, increasing use of
3D chip packaging have accelerated the growth of this market.
For the purpose of providing detailed research report, the global wire bonder equipment market
is segmented on the basis of product type and end user. On the basis of product type the market is
segmented into wedge bonders, stud-bump bonders and ball bonders. Among the various product
types of wire bonder equipment available in the market, the ball bonder is expected to experience
a rapid growth rate owing to its fast speed as compared to the other product types. The ball
bonder is suited for fine pitch applications of 40 micron or less.
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Wire bonder equipment also finds its application across various end user segments including
Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Testing
(OSATs). Among various end user segment, OSATs is expected to witness the growth rate at a
highest CAGR during the forecast period owing to the fact that rapid increase in number ofOSATs vendors that uses wire bonder equipment for advance chip manufacturing. In addition,
increase production capacity and constant technological innovations in packaging technique is
one of the driving factor of wire bonder equipment market. However, the rising research and
development activities and the adoption of innovative technologies by semiconductor packaging
industry is also expected to fuel the market growth.
Geographically, the global Wire bonder equipment market has been further divided into North
America, Europe, Asia Pacific, Middle East and Africa, and Latin America. North America is
expected to hold the largest share of the wire bonder equipment market among the different
regions in 2016. The Asia Pacific wire bonder equipment market is expected to witness a high
growth rate during the forecast period due to the high investments made by the vendors towards
technological developments of chip fabrication process. Moreover, the demand of consumer
electronics in this region has led to the increase in demand of semiconductor packaging and
equipment like wire bonder equipment.
Some of the key vendors operating in the global Wire bonder equipment market includes ASM
Pacific Technology (Netherlands), Kulicke & Sofa (Singapore), Palomar Technologies
(California), F&K Delvotec Bondetechnik (Singapore) among others.
The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative
insights, historical data, and verifiable projections about market size. The projections featured in
the report have been derived using proven research methodologies and assumptions.

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